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Electronic Devices and Components Press Releases

  • 3/7/17 9:00 am EST
    IRVINE, Calif.--(BUSINESS WIRE)--Toshiba America Electronic Components, Inc. (TAEC) today announces that Toshiba, a committed technology leader, was the fastest growing vendor in both the worldwide $25 billion hard disk drive (HDD) segment, as well as in the $17 billion solid state drive (SSD) segment in 2016 over 2015, as measured by revenue and units. These accolades were recognized in two recent IDC reports: “Worldwide Solid State Storage Quarterly Update, CYmore...
  • 3/1/17 12:12 pm EST
    Toshiba America Electronic Components, Inc. (TAEC)* today announced the launch of a series of low-input current drive, rail-to-rail output, gate drive photocouplers: the TLP5771, TLP5772 and TLP5774. A threshold input current of 2mA (max), which is half of Toshiba’s existing products[1], enables the new photocouplers to support bufferless direct drive of low- to medium-power IGBTs and MOSFETs by microcontrollers. The new parts are available in three levels of peak output currents: 1A, 2.5A andmore...
  • 2/24/17 12:13 pm EST
    Toshiba America Electronic Components, Inc. (TAEC)* today announced that it has added a 512 gigabit (Gb)1 (64 gigabyte), 64-layer device with 3-bit-per-cell triple-level cell (TLC) technology to its industry-leading BiCS FLASH™ product line. This technology will enable a 1-terabyte (TB) chip solution. BiCS FLASH is a three-dimensional (3D) flash memory stacked cell structure2and is suitable for applications that require high capacity and performance, such as enterprise and consumer solid statemore...
  • 2/7/17 9:00 pm EST
    IRVINE, Calif.--(BUSINESS WIRE)--Toshiba America Electronic Components, Inc. (TAEC), a committed technology leader, today announces its first MN Series HDDs, bridging the value gap between top-end enterprise capacity HDDs and entry-level desktop HDDs, while still delivering 7,200RPM rotational latency performance. The MN series delivers up to 8TB capacity in a 3.5-inch form factor for a broad range of file and object storage applications. With a 6 Gbit/s2 SATAmore...
  • 2/3/17 3:39 pm EST
    Toshiba America Electronic Components, Inc. (TAEC)* has added a new photorelay to its extensive lineup of photocouplers. Housed in the Toshiba-developed S-VSON4, the industry’s smallest1package, the new TLP3406S is suited for use in automatic test equipment, measuring instruments, high-speed logic IC testers, high-speed memory testers, and probe cards. Semiconductor testers and other applications are pushing photorelays to support higher temperatures in a smaller package size. Toshiba hasmore...
  • 1/10/17 9:23 am EST
    Toshiba America Electronic Components, Inc. (TAEC)* today announced the launch of its JEDEC®1 e-MMCTM Version 5.12-compliant embedded NAND flash memory products that feature an enhanced operational temperature range of -40°C to +105°C. The new parts integrate NAND chips fabricated with 15nm process technology and are well suited to industrial applications including PLC3 and CoMs4, as well as factory automation equipment. The new lineup includes densities of 8 gigabyte (GB), 16GB, 32GB and 64GBmore...
  • 12/20/16 9:17 am EST
    Toshiba America Electronic Components, Inc. (TAEC)* today announced the launch of JEDEC®1 e-MMCTM Version 5.12-compliant embedded NAND flash memory products supporting AEC-Q100 Grade23requirements. The new product lineup consists of densities of 8 gigabyte (GB), 16GB, 32GB and 64GB, and is well suited to the demanding requirements of the automotive infotainment market. As consumer demand for connected cars grows, the need to support the data storage demands of increasingly complex automotivemore...
  • 12/7/16 9:00 am EST
    Toshiba America Electronic Components, Inc. (TAEC)* today announced the availability of a line of CMOS logic ICs in small outline integrated circuit (SOIC) packages: the 74HCxxxD series. These products support flow and reflow soldering, and are suitable for industrial equipment and digital home appliances with logic levels of 6V and lower. The 63 new part numbers in the 74HCxxxD series consist of the most commonly used 74-series logic functions, bringing the total number of CMOS logic ICsmore...
  • 10/25/16 9:00 am EDT
    IRVINE, Calif.--(BUSINESS WIRE)--Toshiba America Electronic Components, Inc. (TAEC), a committed technology leader, today announces its PX04S 12Gbit/s SAS SSDs, which are FIPS 140-2 Level 2 certified, are shipping in NetApp®, hybrid FAS and E-Series systems. Toshiba is a key SSD supplier for NetApp FIPS certified products. With sequential read/write speeds1 of up to 1900 MiB/s / 1100 MiB/s, and random read/write performance of up to 270,000 / 270,000 4KiB2more...
  • 10/5/16 9:00 am EDT
    IRVINE, Calif.--(BUSINESS WIRE)--Toshiba America Electronic Components, Inc. (TAEC), a committed technology leader, will take part in Silicon Valley’s first HyperConverged Infrastructure (HCI) Conference, being held at Quanta Cloud Technology (QCT) US Solution Center in San Jose, tomorrow, Oct. 6. Jeff (Shigeo) Ohshima, SSD Technology Executive, Storage & Electronic Devices Solutions at Toshiba, is scheduled to lead a breakout session during the event. Jeff is one ofmore...

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