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Electronic Devices and Components Press Releases

  • 9/25/17 10:00 pm EDT
    IRVINE, Calif.--(BUSINESS WIRE)--Toshiba America Electronic Components, Inc. (TAEC), a committed technology leader, today announces the 10TB 1 MG06 Series Enterprise Capacity HDD model line-up. Toshiba’s new MG06 series offers a 25 percent capacity increase compared to prior generations and enables models to be delivered at multiple capacity points to better leverage capacity refresh qualification cycles for OEMs/ODMs infrastructure builders, cloud solution providers (more...
  • 9/12/17 8:00 am EDT
    IRVINE, Calif.--(BUSINESS WIRE)--Toshiba America Business Solutions today announced it is the official document solutions partner of the Anaheim Ducks. The multi-year partnership equips the National Hockey League team with Toshiba’s industry-recognized e-STUDIO™ multifunction printers (MFPs) featuring Elevate™ , a new technology that enables Toshiba MFPs to provide a custom-designed user interface for clients. Toshiba MFPs will improve productivity andmore...
  • 9/11/17 10:00 pm EDT
    IRVINE, Calif.--(BUSINESS WIRE)--Toshiba America Electronic Components, Inc. (TAEC), a committed technology leader, today announces its new MQ04 Series 1TB1 HDD, which is compatible with notebook PCs, game systems, all-in-one slim-line desktop systems, set-top box appliances, and other applications requiring high capacity and durability storage. The MQ04 Series single-disk model delivers 1TB of data storage capacity in an ultra-compact 2.5-inch, 7mm heightmore...
  • 8/22/17 9:00 am EDT
    IRVINE, Calif.--(BUSINESS WIRE)--Toshiba America Electronic Components, Inc. (TAEC), a committed technology leader, today announces the X300 3.5-inch1 internal hard drive in 8TB2 capacity. Compared to the P300 series with capacities up to 3TB, the X300 Series delivers extreme performance and robust capacity for creative and professional applications including graphic design, animation, photo and video editing, and PC gaming. The new 8TB model featuresmore...
  • 8/9/17 10:00 pm EDT
    IRVINE, Calif.--(BUSINESS WIRE)--Toshiba America Electronic Components, Inc. (TAEC), a committed technology leader, is pleased to announce it has won the Flash Memory Summit “Best of Show” award for Most Innovative Flash Memory Technology in the Data Center category. Toshiba exceeded Facebook’s ambitious IO Determinism (IOD) performance target with their NVM Express® (NVMe™)1 based drives modified with “sets” architecture, showing improvements of up to two orders ofmore...
  • 8/8/17 9:00 am EDT
    IRVINE, Calif.--(BUSINESS WIRE)--Toshiba America Electronic Components, Inc. (TAEC), a committed technology leader, announces the new SG6 series, the latest Toshiba client SSD to feature 64-layer, 3-bit-per-cell TLC (triple-level cell) BiCS FLASH™ to deliver better transfer speeds and power efficiency1. This family of SSDs is designed for mainstream desktops and notebooks, consumer upgrades, as well as applications needing data security. With increasedmore...
  • 8/7/17 10:00 am EDT
    IRVINE, Calif.--(BUSINESS WIRE)--Toshiba America Electronic Components, Inc. (TAEC), a committed technology leader, today unveiled software technology essential to enabling deployment of NVMe-oF™ (NVM Express® over Fabrics)2. This sophisticated software stack deploys on storage servers, and provides critical solid state drive (SSD) abstraction, security and manageability currently lacking from existing open source implementations. Addressing cloud data centers withmore...
  • 8/7/17 9:00 am EDT
    IRVINE, Calif.--(BUSINESS WIRE)--Toshiba America Electronic Components, Inc. (TAEC), a committed technology leader, today unveiled the development of two new flagship enterprise solid state drive (SSD) solutions, the TMC PM5 12Gbit/s SAS series and the CM5 NVM Express® (NVMe™)1 series. Development is expected to be completed in the fourth quarter. Both product lines are built with TMC’s latest 64 layer, 3-bit-per-cell enterprise-class TLC (triple-level cell) BiCS FLASH™2more...
  • 8/3/17 9:00 am EDT
    IRVINE, Calif.--(BUSINESS WIRE)--Toshiba America Electronic Components, Inc. (TAEC), a committed technology leader, today announced the availability of the state-of-the-art BG3 series, its next generation single-package ball grid array (BGA) solid state drive (SSD) product line based on Toshiba’s latest 64-layer, 3-bit-per-cell TLC (triple-level cell) BiCS FLASH™. Designed to fuel the future of mobile devices, Toshiba’s BG3 SSDs deliver better performance1 and a smallermore...
  • 7/27/17 9:44 am EDT
    Toshiba America Electronic Components, Inc. (TAEC)* has introduced four new 20V MOSFETs that feature some of the lowest on-resistance specifications in the industry. Housed in small SOT-23F packages, the SSM3K344R, SSM3K345R, SSM3J355R and SSM3J358R are suitable for lowering the power consumption in power supply controls for individual function blocks, or for power supply distribution. Applications include mobile devices, such as PCs, laptops and tablets, in addition to other consumer productsmore...

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