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  • 7/27/17 9:44 am EDT
    Toshiba America Electronic Components, Inc. (TAEC)* has introduced four new 20V MOSFETs that feature some of the lowest on-resistance specifications in the industry. Housed in small SOT-23F packages, the SSM3K344R, SSM3K345R, SSM3J355R and SSM3J358R are suitable for lowering the power consumption in power supply controls for individual function blocks, or for power supply distribution. Applications include mobile devices, such as PCs, laptops and tablets, in addition to other consumer productsmore...
  • 7/27/17 9:00 am EDT
    IRVINE, Calif.--(BUSINESS WIRE)--Toshiba America Electronic Components, Inc. (TAEC), a committed technology leader, today unveiled the TR200 SATA solid state drive (SSD) series for the retail market. Leveraging Toshiba’s advanced 3-bit-per-cell TLC (triple-level cell) BiCS FLASH™, the TR200 series offers PC gamers and DIY enthusiasts Toshiba’s first upgrade SSD with 64-layer 3D flash memory. Toshiba TR200 SSDs are an easy and affordable way to enhancemore...
  • 7/26/17 9:36 am EDT
    Toshiba Electronic Devices & Storage Corporation today announced that DENSO Corporation (DENSO) is deploying Visconti™4, its latest image-recognition processor dedicated to automotive applications, in next generation, front-camera-based active safety systems. Visconti™4 is a leading-edge, multi-engine road-safety solution that provides drivers with real-time analytics of road conditions and potential dangers.Electronic systems are taking on an increasingly central role in driving,more...
  • 7/26/17 8:00 am EDT
    IRVINE, Calif.--(BUSINESS WIRE)--Toshiba America Business Solutions' e-STUDIO™4508LP, the world's first hybrid copier capable of producing erasable as well as standard monochrome prints, earned Better Buys Q3 2017 Editor's Choice Award. The industry's first-of-its-kind product received the coveted honor by outperforming a wide array of other monochrome copiers in side-by-side comparisons. Better Buys editors were especially impressed by the e-STUDIO4508LP'smore...
  • 7/25/17 9:00 am EDT
    IRVINE, Calif.--(BUSINESS WIRE)--Toshiba America Electronic Components, Inc. (TAEC), a committed technology leader, today announces its collaboration with Lenovo to integrate its PX04P Series of NVM Express® (NVMeTM)1 SSDs with Lenovo’s new ThinkSystemTM and ThinkAgileTM servers2 to drive high performance and endurance while giving customers flexible storage and data center infrastructure options. ThinkSystem servers aim to expand traditional data center infrastructuremore...
  • 7/25/17 8:00 am EDT
    IRVINE, Calif.--(BUSINESS WIRE)--Toshiba America Business Solutions’ e-STUDIO™4508A has earned Keypoint Intelligence - Buyers Lab’s Summer 2017 Pick. Toshiba’s latest monochrome product surpassed comparable multifunction printers in reliability, usability, security, value and features during six months of rigorous, side-by-side product testing. The global document imaging industry resource presents its ‘Pick’ awards twice annually to acknowledge the bestmore...
  • 7/18/17 9:30 am EDT
    Toshiba America Electronic Components, Inc. (TAEC), a committed technology leader, today announced that its lineup of Bluetooth® Low Energy products now offer support for the Bluetooth Mesh standard. Ratified and launched today by the Bluetooth Special Interest Group (SIG), the combination of Bluetooth Mesh and TAEC’s application software enable Toshiba Bluetooth Low Energy products to simultaneously increase communication range, reliability and obstacle penetration capability while alsomore...
  • 7/18/17 8:00 am EDT
    IRVINE, Calif.--(BUSINESS WIRE)--Toshiba America Business Solutions today introduced Elevate™ − a new technology that enables each of the company's multifunction printers (MFPs) to display a user interface custom-designed for the individual client. Engineered for use with the company's latest e-STUDIO™ multifunction printers, Elevate simplifies operation by enabling end users to complete sophisticated multi-step tasks with the touch of a button.more...
  • 7/12/17 9:25 am EDT
    Toshiba America Electronic Components, Inc. (TAEC)* today announced that it has introduced a new lineup of multi-bit, low-capacitance electrostatic discharge (ESD) protection diodes1 for high-speed interfaces. Suitable for use in mobile devices, including smart phones, tablets and wearable devices, the new diodes deliver excellent protection performance and support interfaces including USB 3.0/3.1 and HDMI. The new devices simultaneously deliver low capacitance, low dynamic resistance andmore...
  • 7/11/17 9:16 am EDT
    Toshiba Memory Corporation, the world leader in memory solutions, today announced development of the world's first[1] BiCS FLASH™ three-dimensional (3D) flash memory[2] utilizing Through Silicon Via (TSV)[3]technology with 3-bit-per-cell (triple-level cell, TLC) technology. Shipments of prototypes for development purposes started in June, and product samples are scheduled for release in the second half of 2017. The prototype of this groundbreaking device will be showcased at the 2017 Flashmore...

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