Company's Newest Vector Motor Control MCU Benefits Variable-Speed Brushless DC Motor Control Applications Like Data Center Cooling Systems
Toshiba
America Electronic Components, Inc. (TAEC)*, a committed
leader that collaborates with technology companies to create
breakthrough designs, today expands the Toshiba TX03 series
microcontroller (MCU) family with the launch of its newest TMPM375FSDMG
device. Based on the ARM® Cortex®-M3 core, the TMPM375FSDMG MCU
implements a next-generation vector engine that improves motor control,
reduces component count, energy, and power consumption. The MCU is ideal
for Brushless DC (BLDC) motor control applications like fan and pump
cooling systems, industrial compressors, printers, and motorized tools
that require high reliability, operational efficiencies, and precise
variable speed control.
"Today's announcement highlights the value proposition of the Toshiba
TX03 series of microcontrollers," says Andrew Burt, vice president of
the Analog and Imaging Business Unit, System LSI Group at TAEC. "The
TMPM375FSDMG delivers precise speed control for smooth and quiet
operation, efficient use of energy and effective management of torque
enabled in a very small footprint." He continues, "The MCU is great for
deployment in data and telecom centers that are expanding exponentially
to support cloud-based computing. The cooling systems in these centers
play a critical role in managing operational power and cost
expenditures. The TMPM375FSDMG helps these types of cooling systems run
more efficiently and cost effectively."
The TMPM375FSDMG lowers system cost for field-oriented control by
reducing component count—the analog front end has been removed and 5V
operation cancels the need for a 3V regulator. The combination of an
industry-standard ARM Cortex-M3 CPU, with the specialized vector engine
and high-speed timers, eliminates a costly DSP, further lowering
cost-of-entry for field-oriented motor control. Lastly, the
microcontroller supports a built-in amplifier for single-shunt current
detection that can reduce the number of parts and promote cost reduction.
The TMPM375FSDMG's very small SS0P30 package (7.6 mm x 10 mm, including
pins), and the reduced component count, make it well suited for
space-critical applications. The device is capable of high-speed
operation (25 ns PWM), and its extended temperature range of -40° to
+105° enables the MCU to be uses in a wide range of industrial
applications.
Pricing and Availability
Sample pricing for the TMPM375FSDMG
is $3.50 (U.S.). Samples will be available by the end of June 2013, with
mass production scheduled to begin later in 2013.
*About TAEC
Through proven commitment, lasting relationships and advanced, reliable
electronic components, Toshiba enables its customers to create
market-leading designs. Toshiba is the heartbeat within product
breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip
companies worldwide. A committed electronic components leader, Toshiba
designs and manufactures high-quality flash memory-based storage
solutions, solid state drives (SSDs), hard disk drives (HDDs), discrete
devices, advanced materials, medical tubes, custom SoCs/ASICs, imaging
products, microcontrollers and wireless components that make possible
today's leading smartphones, tablets, cameras, medical devices,
automotive electronics, enterprise solutions and more.
Toshiba
America Electronic Components, Inc. is an independent
operating company owned by Toshiba America, Inc., a subsidiary of
Toshiba Corporation, Japan's largest semiconductor manufacturer and the
world's fifth largest semiconductor manufacturer (Gartner, 2012
Worldwide Semiconductor Revenue, April, 2013). Toshiba Corporation was
founded in 1875 and today has over 554 subsidiaries and affiliates, with
210,000 employees worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.
Information in this press release, including product pricing and
specifications, content of services and contact information, is current
and believed to be accurate on the date of the announcement, but is
subject to change without prior notice. Technical and application
information contained here is subject to the most recent applicable
Toshiba product specifications. In developing designs, please ensure
that Toshiba products are used within specified operating ranges as set
forth in the most recent Toshiba product specifications and the
information set forth in Toshiba's "Handling Guide for Semiconductor
Devices," or "Toshiba Semiconductor Reliability Handbook." This
information is available at http://www.toshiba.com/taec/support/techquestions/index.jsp
or from your TAEC representative.
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