Toshiba
America Electronic Components, Inc., (TAEC)*, a committed leader
that collaborates with technology companies to create breakthrough
designs, knows that, when it comes to storage architecture, enterprises
require a different set of features than consumers, namely - higher
performance, improved endurance and power efficiency. For datacenter
applications - including cloud computing, caching, datacenters, and
database applications - data accessibility and speed are the name of the
game.
In a recently released video,
the third in a series titled "Memory Design Insights" that takes viewers
inside memory design issues with straight talk from Toshiba's memory
experts, Doug Wong, senior member of TAEC's technical staff, details the
advantages that NAND flash brings to the datacenter. These advantages
include more write/erase cycles compared to conventional MLC
NAND and shorter read latency, higher performance, reduced
footprints and lowered storage management and administration costs when
compared to HDD (hard disk drive)-based systems.
Designed for the intense, constantly evolving demands of the enterprise,
Toshiba's two families of enterprise
NAND are eSLC (from 64 Gb-256 Gb) and eMLC (from 128 Gb-512 Gb)1.
When compared to standard consumer MLC devices, these enterprise NAND
offerings bring extended endurance (extended write/erase cycles), and
longer product life. Both families use a Toggle Mode NAND flash
interface, which employs a double data rate transfer.
According to Wong, "Five years ago, 'Enterprise NAND' did not exist.
Realizing that these data-hungry applications would eventually need
high-performing storage solutions that also provided extended endurance,
we created a line of NAND solutions with these needs in mind. Today, the
benefits of enterprise NAND can be clearly seen - including high speed
data streaming and internet access. Toshiba will continue to anticipate
future needs when developing our NAND solutions - to enable a better
connected world."
To view the full video on NAND for the enterprise click here.
For more information on memory products from Toshiba, please visit http://www.toshiba.com/taec/adinfo/technologymoves
orhttp://www.toshiba.com/taec/index.jsp.
About TAEC
Through proven commitment, lasting relationships and advanced, reliable
electronic components, Toshiba enables its customers to create
market-leading designs. Toshiba is the heartbeat within product
breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip
companies worldwide. A committed electronic components leader, Toshiba
designs and manufactures high-quality flash memory-based storage
solutions, solid state drives (SSDs), hard disk drives (HDDs), discrete
devices, advanced materials, medical tubes, custom SoCs/ASICs, imaging
products, microcontrollers and wireless components that make possible
today's leading smartphones, tablets, cameras, medical devices,
automotive electronics, enterprise solutions and more.
Toshiba
America Electronic Components, Inc. is an independent operating
company owned by Toshiba America, Inc., a subsidiary of Toshiba
Corporation, Japan's largest semiconductor manufacturer and the world's
fifth largest semiconductor manufacturer (Gartner, 2012 Worldwide
Semiconductor Revenue, April, 2013). Toshiba Corporation was founded in
1875 and today has over 554 subsidiaries and affiliates, with 210,000
employees worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.
For additional company and product information, please visit http://www.toshiba.com/taec/.
1Product density is identified based on the density
of memory chip(s) within the Product, not the amount of memory capacity
available for data storage by the end user. Consumer-usable capacity
will be less due to overhead data areas, formatting, bad blocks, and
other constraints, and may also vary based on the host device and
application. Maximum read and write speed may vary depending on the host
device, read and write conditions, and file size.
Information in this press release, including product pricing and
specifications, content of services and contact information, is current
and believed to be accurate on the date of the announcement, but is
subject to change without prior notice. Technical and application
information contained here is subject to the most recent applicable
Toshiba product specifications. In developing designs, please ensure
that Toshiba products are used within specified operating ranges as set
forth in the most recent Toshiba product specifications and the
information set forth in Toshiba's “Handling Guide for Semiconductor
Devices,” or “Toshiba Semiconductor Reliability Handbook.” This
information is available at www.chips.toshiba.com,
or from your TAEC representative.
All trademarks and tradenames held within are the properties of their
respective holders.
