Press Release Details

Toshiba America Electronic Components, Inc., (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced the addition of four new models to its line-up of TOSLINK® fiber optic transmission modules: the TOTX1350(F), TORX1350(F), TOTX1350(V,F) and TORX1350(V,F). The new models have a data rate of direct current (DC) to 10Mb/s for distances up to 100m using all plastic fiber (APF), and are designed for low power consumption.

Toshiba’s TOSLINK is a data transmission system that utilizes optical signals in place of electrical signals. TOSLINK does not emit any electromagnetic noise, and performs more reliably than electrical data transmission, as the optical cable is not susceptible to electromagnetic interference. The new TOSLINK models enable high speed, long distance and low consumption current optical communications, making them well-suited for transmission of control signals in energy sensitive applications including wind and photovoltaic power generation systems, control devices, amusement machines, battery controllers, and various industrial devices.

Utilizing a proprietary high-power, high-reliability infrared LED allows the new TOSLINK models to be driven at a lower current than existing products¹. Transmission distance of 40m to 100m can be achieved with a 6mA drive current, and distances of 0.2m to 50m with a 1.5mA drive current a full ninety percent lower than existing products¹.

In addition to the ability to be driven at a lower current, the new TOSLINK models also employ an optical receiving module that uses a single-chip light sensor IC, which contains a photodiode, an amplifier and a waveform-shaping circuit (automatic threshold control circuit), and operates at 20mA (max).

The new TOSLINK models are available in both horizontal-type and vertical-type packages: The TOTX1350(F) and TORX1350(F) are horizontal-type optical transmitting and receiving modules; and the TOTX1350(V,F) and TORX1350(V,F) are vertical-type optical transmitting and receiving modules.

Main Specifications

• Transmitting side: IF=6mA (Transmission distance 40m to 100m) / IF=1.5mA (Transmission distance 0.2m to 50m)
• Receiving side: 20mA (max.) / 9mA (typ.)
• Data rate: DC to 10Mb/s (NRZ code)
• Transmission distance:0.2m to 100m (Using APF)
• Compatible with the JIS F05 optical connector.
• Operating temperature: -40°C to 85°C
• Power supply voltage: 5±0.25V

Pricing and Availability

Mass production of the new TOSLINK models is scheduled to begin in April. Please contact your local Toshiba Sales Office for samples and pricing.

About TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today’s leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.

Toshiba America Electronic Components, Inc.is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan’s largest semiconductor manufacturer and the world’s sixth largest semiconductor manufacturer (Gartner, 2013 Worldwide Semiconductor Revenue, December 2013). Toshiba Corporation was founded in 1875 and today has over 554 subsidiaries and affiliates, with 206,087 employees worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.

¹Comparison made to Toshiba existing product: TX1950.

*TOSLINK® is a registered trademark of Toshiba Corporation

Product density is identified based on the density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application. For details, please refer to applicable product specifications

Maximum read and write speed may vary depending on the host device, read and write conditions, and file size. For purposes of measuring read and write speed in this context, 1 megabyte or MB = 1,000,000 bytes

For additional company and product information, please visit http://www.toshiba.com/taec/.

Toshiba America Electronic Components, Inc. All rights reserved. Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.