New Chips Utilize Cutting-Edge 15nm Process
Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced the launch of a class of e-MMC™1 embedded NAND flash memory products that are among the world's smallest2. The new products integrate NAND chips fabricated with Toshiba's cutting-edge 15nm process technology and a controller to manage basic control functions for NAND applications into a single package.
Fully compliant with the latest JEDEC e-MMC standard, the new chips are designed for application in a wide range of digital consumer products, including smartphones, tablet PCs and wearable devices. Sample shipment of the 16 gigabyte3 (GB) products begins today, with 8GB, 32GB, 64GB, and 128GB products to follow.
By utilizing the 15nm process technology, the new product's package size is approximately 26 percent smaller4 than comparable Toshiba products5 and offers faster read/write performance due to improvements in basic chip performance and controller optimization. The read speed is approximately eight percent faster (max.), while the write speed is approximately 20 percent faster (max.).
"With the introduction of 15nm-based e-MMC, Toshiba continues to demonstrate its leadership in NAND Flash and embedded memory solutions targeting mobile and wearable devices," noted Scott Beekman, director of managed NAND memory products for TAEC. "The small 11mm x 10mm package, supporting a wide range of densities, is well-suited for increasingly space limited applications."
Demand continues to grow for large density NAND flash memory chips that support high resolution video and deliver enhanced storage. This is particularly true in the area of embedded memories with a controller function, which minimize development requirements and ease integration into system designs. Toshiba is meeting this demand by reinforcing its line-up of high performance and high density memory products.
New Product Line-up
| Product Name | Capacity | Category | Package | Mass Production |
THGBMFG6C1LBAIL | 8GB | Supreme | 11.5x13x0.8mm | 2Q, 2015 (Apr.-Jun.) |
THGBMFG6C1LBAIT | 8GB | Supreme | 11x10x0.8mm | 2Q, 2015 (Apr.-Jun.) |
THGBMFG7C2LBAIL | 16GB | Supreme | 11.5x13x0.8mm | 1Q, 2015 (Jan.-Mar.) |
THGBMFG7C2LBAIW | 16GB | Supreme | 11x10x1.0mm | 1Q, 2015 (Jan.-Mar.) |
THGBMFG7C1LBAIL | 16GB | Premium | 11.5x13x0.8mm | 1Q, 2015 (Jan.-Mar.) |
THGBMFG8C4LBAIR | 32GB | Supreme | 11.5x13x1.0mm | 1Q, 2015 (Jan.-Mar.) |
THGBMFG8C4LBAIW | 32GB | Supreme | 11x10x1.0mm | 1Q, 2015 (Jan.-Mar.) |
THGBMFG8C2LBAIL | 32GB | Premium | 11.5x13x0.8 mm | 1Q, 2015 (Jan.-Mar.) |
THGBMFG9C8LBAIG | 64GB | Supreme | 11.5x13x1.2mm | 1Q, 2015 (Jan.-Mar.) |
THGBMFG9C8LBAIX | 64GB | Supreme | 11x10x1.2mm | 1Q, 2015 (Jan.-Mar.) |
THGBMFG9C4LBAIR | 64GB | Premium | 11.5x13x1.0mm | 1Q, 2015 (Jan.-Mar.) |
THGBMFT0CBLBAIS | 128GB | Supreme | 11.5x13x1.4mm | 2Q, 2015 (Apr.-Jun.) |
*In Toshiba e-MMC categories, "Supreme" represents products suit ed to high - end class applications and "Premium" represents products for middle - and low - end class applications.
Key Features
- The JEDEC e - MMC compliant interface handles essential functions, including writing block management, error correction and driver software. It simplifies system development, allowing manufacturers to minimize development costs and speed up time to market for new and upgraded products. Additionally, new features6 among them BKOPS control, Cache Barrier, Cache Flushing Report, and Large RPMB Write , are applied to the new products to enhance usability.
- The 8GB to 64GB products are sealed in a small FBGA package measuring just 11mm x 10mm and are suitable for smartphone s , tablet PCs and wearable devices where miniaturization and weight saving are a requirement.
- Embedded in a system, the 128GB products can record up to 16.3 hours of full spec high definition video and 39.7 hours of standard definition video7
Key Specifications
| Interface | JEDEC e-MMC V5.0 standard HS-MMC interface |
| Capacity | 8GB, 16GB, 32GB, 64GB, 128GB |
| Power Supply Voltage | 2.7 - 3.6V (Memory core)
1.7V - 1.95V , 2.7V - 3.6V (Interface) |
| Bus Width | x1, x4, x8 |
| Temperature Range | -25°C to +85°C |
| Package | 153Ball FBGA
11.5mm x 13.0mm, 11.0mm x 10.0mm |
*About TAEC
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's sixth largest semiconductor manufacturer (Gartner, 2013 Worldwide Semiconductor Revenue, April 2014). Founded in Tokyo in 1875, Toshiba is at the heart of a global network of over 590 consolidated companies employing over 200,000 people worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.
For additional company and product information, please visit http://www.toshiba.com/taec/.
1e-MMC is a product category for a class of embedded memory products built to the JEDEC e - MMC Standard specification and is a trademark of the JEDEC Solid State Technology Association.
2As of September 30th 2014. Toshiba survey. Excluding the 128GB product.
3Product density is identified based on the density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application. Maximum read and write speed may vary depending on the host device, read and write conditions, and file size. For purposes of measuring read and write speed in this context, 1 megabyte or MB = 1,000,000 bytes.
4 Excluding the 128GB product.
5High-speed class e - MMC embedded NAND flash memory products using 19nm second generation process technology.
6 "BKOPS control" is a function where the host allow s the device to perform background operation during the device's idle time. "Cache Barrier" is a function that controls when cache data is written to the memory chip. "Cache Flushing Report" is a function that informs the host if the device's flushing policy is FIFO or not. "Large RPMB write" is a function that enhances the data size that can be written to the RPMB area to 8kB. Functions were not present in prior Toshiba models.
7HD and SD are calculated at average bit rates of 17Mbps and 7Mbps, respectively.
* The product s are labeled based on the memory chip(s) it contains, not the amount of memory capacity available for data storage by the end user. Part of the capacity is reserved for card functionality. Please refer to the data sheet or your local Toshiba sales representative.
( For purposes of measuring memory capacity in this context, 1GB = 1,073,741,824 bytes.)
* Read and write speeds are calculated as 1MB/s = 1,000,000bytes/s.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.